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Tata Electronics, Bosch ink MoU to ramp up semiconductor and chip‑packaging in India
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Tata Electronics, Bosch ink MoU to ramp up semiconductor and chip‑packaging in India

By July 21, 2025 5:06 pm IST

Tata Electronics has partnered with Germany’s Bosch to develop semiconductors and chip packaging in India. The collaboration will boost local production for the automotive and electronics sectors.

Robert Bosch GmbH and Tata Electronics have signed a Memorandum of Understanding (MoU) to work together on a number of significant topics within the electronics and semiconductor industries.

Dirk Kress, Executive Vice President Semiconductor Operations, Robert Bosch GmbH, and Dr. Randhir Thakur, CEO & MD, Tata Electronics, signed an Agreement of Cooperation.

Bosch and Tata Electronics aim to work closely on chip packaging and manufacturing at the latter’s future Gujarati foundry and Assamese assembly and verification facility. Finding and pursuing regional projects within Electronic Manufacturing Services (EMS) for automotive electronics that benefit both businesses is a secondary exploration area.

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The CEO and MD of Tata Electronics, Dr. Randhir Thakur, expressed his enthusiasm for the opportunity to collaborate with Bosch to assist Bosch in the establishment of a dependable and resilient supply chain for critical technology products. He said, “This partnership is in line with our dedication to the establishment of a broad semiconductor and electronics ecosystem in India, which will supply consumers worldwide with things that are in market.”

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