New system for structural adhesive bondings

By OEM Update Editorial June 10, 2019 6:50 pm IST

Weicon has developed a new epoxy resin system especially for structural adhesive bondings, Weicon HP(high performance).This product is a 2-component epoxy resin system with extremely high impact resistance, and is practically shrink-free.
The adhesive shows high adhesive strength and can be used universally on nearly all surfaces.Its pasty texture makes it non-drip and spreadable. That way, it can also be used on vertical surfaces and even for overhead applications.
Thanks to its high elongation at break, the system is also suitable for adhesive bondings on heavily vibrating components.

Versatile use

Weicon HP can be used for numerous applications, for example, for lining heavily stressed pump housings, as wear protection for slide bearings, chutes and pipes and wherever darker-coloured adhesives are not suitable for visual reasons.

Plastic metal

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